JR82072 Intern - APTD Process

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Department Introduction

Join Micron’s Advanced Packaging Technology Development (TD) team, where innovation meets precision in developing next-generation interconnect technologies. Our team drives ground breaking solutions that enhance semiconductor performance and reliability.

Position Overview

As an Advanced Package TD Process Intern, you will collaborate with experienced engineers to support the development of sophisticated interconnect technologies. This internship provides hands-on experience in problem-solving, line monitoring, data analysis, and project management, contributing directly to yield improvement and process optimization.

Responsibilities

Lead problem-solving activities using structured methodologies such as KT (Kepner-Tregoe)

Define and implement Design of Experiments (DoE) for process development

Present findings and collaborate across sites and teams

Support line monitoring through project management and yield improvement initiatives

Develop new line monitoring methods and critical metrics

Minimum Qualifications

Pursuing a PhD; ideally in 3rd or 4th year of the program. 

Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026

Excellent data extraction, analysis, and reporting skills (e.g., system analytics, JMP)

Strong collaboration and communication skills across multi-functional teams

Ability to prioritize multiple complex tasks and adapt to changing responsibilities

Tenacity to work under timelines and limited resources

Preferred Qualifications

Experience with semiconductor process technologies

Familiarity with structured problem-solving and decision-making frameworks

Exposure to experimental design and statistical analysis tools

Interest in advanced packaging and interconnect development