Senior Engineer of Hardware Technology - Hardware Miniaturization and SIP Technology (Ph.D.)

Hardware miniaturization technology research and development, from the field of circuit integration, packaging design, reliability engineering, process manufacturing, electromagnetic, power high-speed signal, chips, materials and other fields to achieve a higher integration design of hardware;

Key technologies: Sip, system-level integration, packaging, electronic materials, PI\SI, power supply hardware, integrated circuit design, microelectronics, supporting the great changes and innovations of hardware engineering technology in the 5G era. 

Job requirements

1. Electronics, communication, automation, electrical engineering, mechanical electronics, materials, technology, mechanics, electronic packaging, semiconductor, computer, semiconductor physics and materials, optoelectronics, wireless and microwave, automatic control, automation and other related majors;

 2. Familiar with packaging Material, structure, stress, heat dissipation performance, and device reliability, preferably with experience in the packaging industry;

 3. Have a good foundation in digital, analog circuits, and semiconductor principles;

 4. Strong communication and organizational skills;

 5 , Good English reading and writing skills;

 6. Teamwork spirit;

 7. One of the following conditions is preferred:

 (1) Have actual experience in packaging engineering development and design, with APD, Ansys and other packaging design Tool experience;

 (2) Experience in single-board hardware development and single-board assembly or related process knowledge;

 (3) Proficient in one or more simulation software such as HFSS, CST, ADS, etc.

8.  8 hours work day.

 Recruitment Requirements: Chinese Ph.D. graduates from domestic and overseas universities

 Graduation time: January 1, 2022-December 31, 2023