FIB and Failure Analysis Engineer (7181)

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

SUMMARY:
FIB-SEM/Failure Analysis Engineer Seeking a recent college graduate to perform Focused Ion Beam (FIB) and Failure Analysis to determine failure root-causes on yield fall-out, aging & environmental stress failures, and customer returns.

 Shift: 5 (8 hour) days 3 pm to 12 midnight. 

RESPONSIBILITIES:

• The primary responsibility for this position is to conduct hands-on FIB activities of a semiconductor manufacturer.
  • Plan, schedule, and conduct the analysis from start to finish.
  • Document and maintain analysis information and results and complete analysis reports.
  • Work with circuit design, product, process, failure analysis, reliability & test engineers to understand their requirements so as to provide the results they need.
  • Drive quality improvement and provide corrective action recommendations.
  • Plan, schedule, coordinate, and conduct detailed phases of FIB analysis. Interface with outside services and analytical laboratories.

• In addition to the FIB duties, as time permits, the successful hire will spend some time learning basic physical Failure Analysis processes.  These may include the following:
  • Perform DC electrical testing, circuit analysis/trouble shooting, fault isolation, micro-probing, de-processing, material analysis and failure duplication.
  • Plan, schedule & conduct the analysis from start to finish.
  • Document and maintain analysis information and results and complete analysis reports.
  • Understand product functions, product circuits, device structure and fab processes.

QUALIFICATIONS & REQUIREMENTS:
 

• Bachelor’s Degree in science or engineering discipline required
• Experience or familiarity with the following is desirable:
  • Using a Dual Beam FIB-SEM for cross-sectioning, imaging and EDX analysis in a semiconductor company
  • Experience with curve tracing and/or parametric test programming languages
  • Knowledge of semiconductor processing and analysis equipment
  • Experience in handling semiconductor wafers and working with integrated circuits
• Will require some de-processing and decapsulation of semiconductor products using chemicals and gases
• Must be able to lift 20 lbs
• Must have analytical skills and good written and verbal communications skills
• Versatility and ability to work on multiple tasks concurrently is expected
• Ability to work independently as a self-starter with flexibility to adjust to changing priorities
• Must have a strong desire for hands-on work in a lab environment
• Act as a facilitator of continuous improvement, working on proactive and preventative changes

MAKE A DIFFERENCE AT QORVO   

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.