Advanced Package Substrates Development Engineer

Position: ADVANCED PACKAGE SUBSTRATES DEVELOPMENT ENGINEER

Location: COVINGTON, GA

DUTIES/RESPONSIBILITIES:

• Lead the development of advanced package substrates from concept to production, utilizing innovative materials and processes to meet performance and reliability requirements.
• Collaborate closely with cross-functional teams including design, process engineering, and quality assurance to ensure successful execution of projects.
• Conduct feasibility studies, design experiments, and perform analyses to evaluate substrate materials, structures, and manufacturing processes.
• Define and optimize substrate designs for electrical performance, thermal management, and mechanical integrity.
• Drive continuous improvement initiatives to enhance substrate performance, manufacturability, and cost-effectiveness.
• Generate technical documentation including design specifications, test plans, and reports to communicate project status and findings.
• Stay abreast of industry trends, emerging technologies, and competitive developments related to advanced package substrates.

REQUIREMENTS:

• Strong understanding of substrate materials, fabrication processes, and assembly techniques.
• Hands-on experience with advanced packaging technologies such as flip-chip, fan-out, and 2.5D/3D integration.
• Excellent problem-solving skills and ability to work independently or as part of a team.
• Commitment to quality, attention to detail, and dedication to meeting project deadlines.
• Effective communication skills with the ability to present technical information clearly and concisely.

QUALIFICATIONS:

• Must be legally permitted to work in the United States
• Ability to learn and pick up new technologies very quickly
• Exceptional time management skills with the ability to work in a fast-paced environment
• Proficiency in using Microsoft Office applications

EDUCATION:

• Master’s degree or higher in Electrical Engineering, Material Science, or a related field

EXPERIENCE:

• 1 + years of experience in semiconductor packaging with a focus on substrate development preferred but not required