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Advanced Package Substrates Development Engineer

Position: ADVANCED PACKAGE SUBSTRATES DEVELOPMENT ENGINEER

Location: COVINGTON, GA

 

DUTIES/RESPONSIBILITIES:

  • Lead the development of advanced package substrates from concept to production, utilizing innovative materials and processes to meet performance and reliability requirements.
  • Collaborate closely with cross-functional teams including design, process engineering, and quality assurance to ensure successful execution of projects.
  • Conduct feasibility studies, design experiments, and perform analyses to evaluate substrate materials, structures, and manufacturing processes.
  • Define and optimize substrate designs for electrical performance, thermal management, and mechanical integrity.
  • Drive continuous improvement initiatives to enhance substrate performance, manufacturability, and cost-effectiveness.
  • Generate technical documentation including design specifications, test plans, and reports to communicate project status and findings.
  • Stay abreast of industry trends, emerging technologies, and competitive developments related to advanced package substrates.

 

REQUIREMENTS:

  • Strong understanding of substrate materials, fabrication processes, and assembly techniques.
  • Hands-on experience with advanced packaging technologies such as flip-chip, fan-out, and 2.5D/3D integration.
  • Excellent problem-solving skills and ability to work independently or as part of a team.
  • Commitment to quality, attention to detail, and dedication to meeting project deadlines.
  • Effective communication skills with the ability to present technical information clearly and concisely.

 

QUALIFICATIONS:

  • Must be legally permitted to work in the United States
  • Ability to learn and pick up new technologies very quickly
  • Exceptional time management skills with the ability to work in a fast-paced environment
  • Proficiency in using Microsoft Office applications

 

EDUCATION:

  • Master’s degree or higher in Electrical Engineering, Material Science, or a related field

 

EXPERIENCE:

  • 1 + years of experience in semiconductor packaging with a focus on substrate development preferred but not required