2024 US Campus Recruitment - R&D
R&D
R&D Engineers conduct exploratory research and new process pathfinding to enable the next nodes, new device architecture, and integration. R&D Engineers also develop advanced processes, materials, tools, models, and computational methodologies for leading-edge technologies.
Design & Technology Platform Engineer partner closely with customers to develop and launch advance module technologies for volume semiconductor production. Engineers are also responsible for ensuring competitiveness in power, performance, and area.
Integrated Interconnect & Packaging Engineer initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development.
Pathfinding for System Integration Engineer research and pioneers advanced packaging and system integration technologies. Our goal is to push the boundaries of Moore’s Law and explore new possibilities in the post-Moore era.
Qualifications:
- Master’s degree in electrical, chemical or computer engineering or related field in science
- Deep understanding of place and route flow
- Passionate about the development of world leading technologies
- Customer-first mindset
- Excellent interpersonal and communication skills
- Self-motivated and team player
- Mandarin Chinese preferred but not required
- Willing to relocate to Taiwan (relocation assistance provided)