Process Engineer (Pretreatment, DF Lami, Exposure, Develop, Strip, Etching)

DUTIES/RESPONSIBILITIES:

• Manage the lithography process and technology
• Develop and implement strategies to optimize plating processes, improve efficiency, and meet production targets
• Maintain and support process optimization based on the knowledge of ABF/glass/PR & DFR materials
• Develop and maintain documentation including standard operating procedures (SOPS), work instructions, and process specifications
• Perform statistical process control tasks using statistical tools 

REQUIREMENTS:

• Strong technical expertise in lithography equipment, processes, and photosensitive materials
• In-depth technical knowledge of relevant process and industry
• Proven track record of leadership and management in a substrate for semiconductor manufacturing
• Ability to work well in a team environment.

QUALITIFICATIONS:

• In-depth technical knowledge of relevant process and industry
• Effective communication skills and ability to collaborate with colleagues.
• Must be at least 18 years old and authorized to work in the United States

EDUCATION:

• Bachelor’s degree or higher in engineering or science (material science and engineering, chemical engineering, or chemistry)

EXPERIENCE:

• 0+ years of experience in the industry with a focus on PI passivation and coating process.