Component Engineer (Semiconductor/Wafer)
Summary:
Perform functions related to, quotations, technical support, and conceptual designs of alternate solutions for customers.
Essential Duties & Responsibilities:
• Review and analyze customer RFQs to establish customer requirements and alignment to Micross capabilities. Compile information such as military specifications, Customer SCDs, and data sheets as part of the review process.
• Provide cost structure for both custom quotes and standard products.
• Develop solutions to customer specified requirements for packaging, test and screening. In addition offer alternative device solution as appropriate in light of availability and alignment to Micross sources of supply.
• Review product designs for compliance with engineering principles, company standards, customer contract requirements, and related specifications.
• Interface with customers to discuss company products and services as well as customer specifications and the integration of company services into customer projects.
• Interface with vendors of materials, products, and services that augment Micross capabilities to evaluate capabilities, lead times and pricing as well as future business development opportunities.
• Communicate with semiconductor manufacturers, vendors, and customers to discuss technical related information regarding customer applications and new product developments.
• Clean up and subsequently maintain standard documentation and support resources.
• Focus of role will be ~70/30 pre-sale/post-sale time split and ~60/40 packaging die.
Other Duties & Responsibilities:
• Perform or assist with any operations, as required to maintain workflow and to meet schedules and quality requirements.
• Maintain safe work area and comply with safety procedures and equipment operating rules keeping work area in a clean and orderly condition.
• Participate in any variety of meetings and work groups to integrate activities, communicate issues, obtain approvals, resolve problems and maintain specified level of knowledge pertaining to new developments, requirements, and policies.
• Perform other related duties as assigned
TOOLS AND EQUIPMENT USED:
• Proficiency with CAD, CAE, schematic capture, layout, and simulation tools are a plus.
• Typical computer tools and peripherals to produce the documents and materials above.
• Standard office equipment.
Job Qualifications:
• BSEE, BSME or equivalent 4-year engineering degree.
• Five years of relevant experience in semiconductor or microelectronics industry preferred.
• Capable of immediately development of prototype board designs, migrating to expanded design responsibilities once trained on Micross die level packaging and wafer bumping capability/design rules.
Job Skills:
• Team player who can multi-task effectively in a fast-paced, lean environment while maintaining quality standards.
Benefits:
At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.
Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.